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dla 95158 www.vishay.com vishay revision: 12-may-16 1 document number: 40120 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid tantalum surface mount chip capacitors t antamount ?, molded case, dla approved, low esr performance / electrical characteristics www.vishay.com/doc?40211 operating temperature: -55 c to +125 c ? (above 85 c, voltage derating is required) capacitance range: 4.7 f to 220 f capacitance tolerance: 10 %, and 20 % voltage rating: 6 v dc to 50 v dc features ? meets mil-prf-55365 and eia535baac mechanical and performance requirements ?low esr ? terminations: gold and ti n / lead solder plated ? molded case available in 3 case codes ? high ripple current carrying capability ? high reliability inspection: mil-prf-55365, group a inspection (exponential distribu tion); subgroups 1 and 3 with voltage aging a minimum of 10 h. 100 % surge current tested - temperature: 25 c - applied voltage: rated voltage - test cycles: 4 - charge and discharge cycles: 4 s maximum - total dc resistance: 0.6 ? maximum applications ? military / aerospace note ? glue pad (non-conductive, part of molded case) is dedicated for glue atta chment (as user option). ordering information 95158- 01 k h t drawing number dash number capacitance tolerance termination finish packaging k = 10 % m = 20 % b = gold plated (10 microinch minimum) h = solder plated (100 microinch minimum) t = 7" (178 mm) reel dimensions in inches [millimeters] case code eia size l w h p t w t h min. c 6032-28 0.236 0.012 [6.0 0.30] 0.126 0.012 [3.2 0.30] 0.098 0.012 [2.5 0.30] 0.051 0.012 [1.3 0.30] 0.087 0.004 [2.2 0.10] 0.039 [1.0] d 7343-31 0.287 0.012 [7.3 0.30] 0.170 0.012 [4.3 0.30] 0.110 0.012 [2.8 0.30] 0.051 0.012 [1.3 0.30] 0.095 0.004 [2.4 0.10] 0.039 [1.0] e 7343-43 0.287 0.012 [7.3 0.30] 0.170 0.012 [4.3 0.30] 0.158 0.012 [4.0 0.30] 0.051 0.012 [1.3 0.30] 0.095 0.004 [2.4 0.10] 0.039 [1.0] l t h min. h w t w p glue pad glue pad
dla 95158 www.vishay.com vishay revision: 12-may-16 2 document number: 40120 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ratings and case codes f 6 v 10 v 16 v 20 v 25 v 35 v 50 v 4.7 ce 6.8 e 10 d / e 15 d d / e e 22 d e e 33 d e 47 d d e 68 d e e 100 d / e e 150 e d / e 220 d / e e marking marking: capacitor marking includes an anode (+) polarity band , capacitance in microfarads and the voltage rating. the vishay identification is included if space permits. a manufacturing date code is marked on all capacitors. call the factory for further explanation. date code vi s hay marking voltage capacitance f polarity band (+) 22 10 xx 2 c, d, e cases
dla 95158 www.vishay.com vishay revision: 12-may-16 3 document number: 40120 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 standard ratings capacitance (f) case code part number max. dc leakage (a) max. df (%) max. esr at +25 c 100 khz ( ? ) max. ripple 100 khz i rms (a) +25 c +85 c +125 c +25 c +85 c +125 c -55 c 6 v dc at +85 c; 4 v dc at +125 c 68 d 95158-01(1)(2)(3) 3.3 19.8 33.0 4 6 6 0.175 0.93 150 e 95158-02(1)(2)(3) 7.2 43.2 72.0 6 8 8 0.125 1.15 220 d 95158-25(1)(2)(3) 13.2 132.0 165.0 8 12 12 0.100 1.22 220 e 95158-03(1)(2)(3) 13.2 132.0 165.0 8 12 12 0.100 1.28 10 v dc at +85 c; 7 v dc at +125 c 47 d 95158-04(1)(2)(3) 3.8 22.8 38.0 4 6 6 0.200 0.87 68 e 95158-05(1)(2)(3) 5.4 32.4 54.0 4 6 6 0.150 1.05 100 d 95158-06(1)(2)(3) 10.0 100.0 125.0 8 12 12 0.100 1.22 100 e 95158-07(1)(2)(3) 8.0 48.0 80.0 6 8 8 0.100 1.28 150 e 95158-08(1)(2)(3) 15.0 150.0 187.5 8 12 12 0.100 1.28 150 d 95158-26(1)(2)(3) 15.0 150.0 187.5 8 12 12 0.100 1.22 220 e 95158-28(1)(2)(3) 15.0 150.0 187.5 8 12 12 0.100 1.28 16 v dc at +85 c; 10 v dc at +125 c 33 d 95158-09(1)(2)(3) 4.2 25.2 42.0 4 6 6 0.250 0.77 47 d 95158-10(1)(2)(3) 7.5 75.0 94.0 6 9 9 0.200 0.87 100 e 95158-11(1)(2)(3) 16.0 160.0 200.0 8 12 12 0.125 1.15 20 v dc at +85 c; 13 v dc at +125 c 15 d 95158-12(1)(2)(3) 2.4 14.4 24.0 4 6 6 0.275 0.74 22 d 95158-13(1)(2)(3) 3.5 21.0 35.0 4 6 6 0.275 0.74 47 e 95158-14(1)(2)(3) 7.5 45.0 75.0 4 6 6 0.150 1.05 68 e 95158-15(1)(2)(3) 13.6 136.0 170.0 6 9 9 0.150 1.05 25 v dc at +85 c; 17 v dc at +125 c 15 d 95158-16(1)(2)(3) 3.8 38.0 46.9 6 9 9 0.275 0.74 15 e 95158-17(1)(2)(3) 3.0 18.0 30.0 4 6 6 0.200 0.91 22 e 95158-18(1)(2)(3) 4.4 26.4 44.0 4 6 6 0.225 0.86 33 e 95158-19(1)(2)(3) 6.6 39.6 66.0 4 6 6 0.175 0.97 35 v dc at +85 c; 23 v dc at +125 c 4.7 c 95158-29(1)(2)(3) 1.7 10.2 17.0 6 9 9 0.600 0.43 6.8 e 95158-20(1)(2)(3) 1.9 11.4 19.0 4 6 6 0.300 0.74 10 d 95158-27(1)(2)(3) 3.5 35.0 42.0 4 6 6 0.300 0.71 10 e 95158-21(1)(2)(3) 2.8 16.8 28.0 4 6 6 0.250 0.81 15 e 95158-22(1)(2)(3) 5.3 53.0 65.6 6 9 9 0.225 0.86 22 e 95158-23(1)(2)(3) 7.7 77.0 96.3 6 9 9 0.300 0.74 50 v dc at +85 c; 33 v dc at +125 c 4.7 e 95158-24(1)(2)(3) 1.9 11.4 19.0 4 6 6 0.300 0.74 note ? part number definitions: (1) tolerance: k, m (2) termination finish: b, h (3) packaging: t
molded guide www.vishay.com vishay sprague revision: 12-sep-17 1 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide for molded tantalum capacitors introduction tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliab ility, and long service life are primary considerations. the stability and resistance to elevated temperatures of the tantalum / tantalum oxide / manganese dioxide system make solid tantalum capacitors an appropriate choice for toda y's surface mount assembly technology. vishay sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. tantalum is not found in its pure state. rather, it is commonly found in a number of oxide minerals, often in combination with columbium ore. this combination is known as tantalite when its contents are more than one-half tantalum. important sources of tantalite include australia, brazil, canada, china, an d several african countries. synthetic tantalite concentrates produced from tin slags in thailand, malaysia, and brazil are also a significant raw ma terial for tantalum production. electronic applications, an d particularly capacitors, consume the largest share of world tantalum production. other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. vishay sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperatu re vacuum processing. the basics of tantalum capacitors most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. a few metals form dens e, stable, tightly adhering, electrically insulating oxid es. these are the so-called valvemetals and include tita nium, zirconium, niobium, tantalum, hafnium, and aluminum. only a few of these permit the accurate contro l of oxide thickness by electrochemical means. of these, the most valuable for the electronics industry are aluminum and tantalum. capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. their function is to store an electrical charge for later use. capacitors consist of two co nducting surfaces, usually metal plates, whose function is to conduct electricity. they are separated by an insulating material or dielectric. the dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. as capacitors are being manufactured, a film of tantalum pentox ide is applied to their electrodes by means of an electrolytic process. the film is applied in various thic knesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. this coloring occurs on the tantalum electrodes of all types of tantalum capacitors. rating for rating, tantalum capacitors tend to have as much as three times better capacitance / volume efficiency than aluminum electrolytic capacitors. an approximation of the capacitance / volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. this, in addition to the fact that extremely thin films can be deposited du ring the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. th e capacitance of any capacitor is determined by the su rface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. in the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. as the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: ? ? where c = capacitance e = dielectric constant a = surface area of the dielectric t = thickness of the dielectric tantalum capacitors contain either liquid or solid electrolytes. in solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. a tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. the drawings show the construction details of the surface mount types of tantalum capacitors sh own in this catalog. comparison of capacitor ? dielectric constants dielectric e dielectric constant air or vacuum 1.0 paper 2.0 to 6.0 plastic 2.1 to 6.0 mineral oil 2.2 to 2.3 silicone oil 2.7 to 2.8 quartz 3.8 to 4.4 glass 4.8 to 8.0 porcelain 5.1 to 5.9 mica 5.4 to 8.7 aluminum oxide 8.4 tantalum pentoxide 26 ceramic 12 to 400k c ea t ------ - =
molded guide www.vishay.com vishay sprague revision: 12-sep-17 2 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid electrolyte tantalum capacitors solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. the pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. the pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the leadframe. molded chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. afte r assembly, the capacitors are tested and inspected to assure long life and reliability. it offers excellent reliability and high stability for consumer and commercial el ectronics with the added feature of low cost surface mount designs of so lid tantalum capacitors use lead frames or lead frameless designs as shown in the accompanying drawings. tantalum capacitors for all design considerations solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. they will typically withstand up to about 10 % of the rated dc working voltage in a revers e direction. also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. vishay sprague patented the original solid electrolyte capacitors and was the first to market them in 1956. vishay sprague has the broadest line of tantalum capacitors and has continued its position of leadership in this field. data sheets covering the various types and styles of vishay sprague capacitors for consumer and entertainment electronics, industry, and milit ary applications are available where detailed performance characteristics must be specified. ? molded chip capacitor, all types except 893d / tf3 / t86 molded chip capacitor with built-in fuse, types 893d / tf3 / t86 leadframe epoxy encap s ulation anode polarity bar s olderable cathode termination s ilver adhe s ive mno 2 /carbon/ s ilver coating s olderable anode termination s intered tantalum s ilver adhe s ive s olderable cathode termination s intered tantalum pellet lead frame fu s ible wire s olderable anode termination anode polarity bar epoxy encap s ulation mno 2 /carbon/ s ilver coating
molded guide www.vishay.com vishay sprague revision: 12-sep-17 3 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 commercial products solid tantalum capacitors - molded case series 293d 793dx-ctc3- ctc4 593d tr3 tp3 tl3 product image type surface mount t antamount ?, molded case features standard industrial grade cecc approved low esr low esr high performance, automotive grade very low dcl temperature range -55 c to +125 c capacitance range 0.1 f to 1000 f 0.1 f to 100 f 1 f to 470 f 0.47 f to 1000 f 0.1 f to 470 f 0.1 f to 470 f voltage range 4 v to 75 v 4 v to 50 v 4 v to 50 v 4 v to 75 v 4 v to 50 v 4 v to 50 v capacitance tolerance 10 %, 20 % leakage current 0.01 cv or 0.5 a, whichever is greater 0.005 cv or 0.25 a, whichever is greater dissipation factor 4 % to 30 % 4 % to 6 % 4 % to 15 % 4 % to 30 % 4 % to 15 % 4 % to 15 % case codes a, b, c, d, e, v a, b, c, d a, b, c, d, e a, b, c, d, e, v, w a, b, c, d, e a, b, c, d, e termination 100 % matte tin standard , tin / lead available solid tantalum capacitors - molded case series th3 th4 th5 893d tf3 product image type surface mount t antamount ?, molded case features high temperature +150 c, automotive grade high temperature +175 c, automotive grade very high temperature +200 c built-in fuse built-in fuse, low esr temperature range -55 c to +150 c -55 c to +175 c -55 c to +200 c -55 c to +125 c capacitance range 0.33 f to 220 f 10 f to 100 f 4.7 f to 100 f 0.47 f to 680 f 0.47 f to 470 f voltage range 6.3 v to 50 v 6.3 v to 35 v 5 v to 24 v 4 v to 50 v 4 v to 50 v capacitance tolerance 10 %, 20 % leakage current 0.01 cv or 0.5 a, whichever is greater dissipation factor 4 % to 8 % 4.5 % to 8 % 6 % to 10 % 6 % to 15 % 6 % to 15 % case codes a, b, c, d, e b, c, d, e d, e c, d, e c, d, e termination 100 % matte tin standard, tin / lead and gold plated available 100 % matte tin gold plated 100 % matte tin standard
molded guide www.vishay.com vishay sprague revision: 12-sep-17 4 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 high reliability products solid tantalum capacitors - molded case series tm3 t83 t86 cwr11 95158 product ? image type t antamount ?, molded case, hi-rel. t antamount ?, molded case, hi-rel. cots t antamount ?, molded case, dla approved features high reliability, for medical instruments high reliability, standard and low esr high reliability, built-in fuse, standard and low esr mil-prf-55365/8 qualified low esr temperature ? range -55 c to +125 c capacitance ? range 1 f to 220 f 0.1 f to 470 f 0.47 f to 330 f 0.1 f to 100 f 4.7 f to 220 f voltage range 4 v to 20 v 4 v to 63 v 4 v to 50 v capacitance ? tolerance 10 %, 20 % 5 %, 10 %, 20 % 10 %, 20 % leakage ? current 0.005 cv or 0.25 a, whichever is greater 0.01 cv or 0.5 a, whichever is greater dissipation ? factor 4 % to 8 % 4 % to 15 % 6 % to 16 % 4 % to 6 % 4 % to 12 % case codes a, b, c, d, e a, b, c, d, e c, d, e a, b, c, d c, d, e termination 100 % matte tin; tin / lead 100 % matte tin; tin / lead; tin / lead solder fused 100 % matte tin tin / lead; tin / lead solder fused tin / lead solder plated; gold plated
molded guide www.vishay.com vishay sprague revision: 12-sep-17 5 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes ? metric dimensions will govern . dimensions in inches are rounded and for reference only. (1) a 0 , b 0 , k 0 , are determined by the maximum dimensions to the ends of the terminals extending fr om the component body and / or the body dimensions of the component. the clearance between the ends of the terminals or body of the co mponent to the sides and depth of the cavity (a 0 , b 0 , k 0 ) must be within 0.002" (0.05 mm) minimum and 0.020" (0. 50 mm) maximum. the clearance allo wed must also prevent rotation of the component within the cavity of not more than 20. (2) tape with components shall pass around radius r without damage . the minimum trailer length may require additional length to p rovide r minimum for 12 mm embossed tape for reels with hub diameters approaching n minimum. (3) this dimension is the flat area from the edge of the sprocket hole to either outward deformatio n of the carrier tape between th e embossed cavities or to the edge of the cavity whichever is less. (4) this dimension is the flat area from the edge of the carrier ta pe opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cav ity or to the edge of the cavity whichever is less. (5) the embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. dimensions of embossement location shall be a pplied independent of each other. (6) b 1 dimension is a reference dimension tape feeder clearance only. plastic tape and reel packaging in inches [millimeters] tape and reel specifications: all case sizes are available on plastic em bossed tape per eia- 481. standard reel diameter is 7" [178 mm], 13" [ 330 mm] reels are available and recommended as the most cost effective packaging method. the most efficient packaging quantities are full reel increments on a given reel diameter. the quantities shown allow for the sealed empty pockets required to be in conformance with eia-481. reel size and packaging orientation must be specified in the vishay sprague part number. case code tape size b 1 (max.) d 1 (min.) f k 0 (max.) p 1 w molded chip capacitors; all types a 8 mm 0.165 [4.2] 0.039 [1.0] 0.138 0.002 [3.5 0.05] 0.094 [2.4] 0.157 0.004 [4.0 1.0] 0.315 0.012 [8.0 0.30] b c 12 mm 0.32 [8.2] 0.059 [1.5] 0.217 0.00 [5.5 0.05] 0.177 [4.5] 0.315 0.004 [8.0 1.0] 0.472 0.012 [12.0 0.30] d e v w 0.004 [0.1] max. k 0 tape thickness b 1 max. (note 6) 0.014 [0.35] max. 0.008 [0.200] embossment 0.069 0.004 [1.75 0.10] d 1 min. for components 0.079 x 0.047 [2.0 x 1.2] and larger . (note 5) maximum cavity size (note 1) user direction of feed center lines of cavity a 0 p 1 f w 0.030 [0.75] min. (note 4) 0.030 [0.75] min. (note 3) 0.079 0.002 [2.0 0.05] 0.157 0.004 [4.0 0.10] 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] b 0 maxim um component rotation (side or front sectional view) 20 for tape feeder reference only including draft. concentric around b 0 (note 5) deformation between embossments to p cover tape to p cover tape 10 pitches cumulative tolerance on tape direction of feed anode (+) cathode (-) 20 maximum component rotation typical component cavity center line typical component center line a 0 b 0 (top view) 0.9843 [250.0] tape 3.937 [100.0] 0.039 [1.0] max. 0.039 [1.0] max. camber (top view) allowable camber to be 0.039/3.937 [1/100] non-cumulative over 9.843 [250.0]
molded guide www.vishay.com vishay sprague revision: 12-sep-17 6 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 recommended reflow profiles capacitors should withstand reflow profile as per j-std-020 standard, three cycles. profile feature snpb eutectic assembly lead (pb)-free assembly preheat / soak temperature min. (t s min. ) 100 c 150 c temperature max. (t s max. ) 150 c 200 c time (t s ) from (t s min. to t s max. ) 60 s to 120 s 60 s to 120 s ramp-up ramp-up rate (t l to t p ) 3 c/s max. 3 c/s max. liquidus temperature (t l ) 183 c 217 c time (t l ) maintained above t l 60 s to 150 s 60 s to 150 s peak package body temperature (t p ) depends on case size - see table below time (t p ) within 5 c of the specified ? classification temperature (t c ) 20 s 30 s time 25 c to peak temper ature 6 min max. 8 min max. ramp-down ramp-down rate (t p to t l ) 6 c/s max. 6 c/s max. 25 temperature (c) time (s) t s t l time 25 c to peak t l t p t c - 5 c t p t s max. t s min. preheat area max. ramp-up rate = 3 c/s max. ramp-down rate = 6 c/s peak package body temperature (t p ) case code peak package body temperature (t p ) snpb eutectic process lead (pb)-free process a, b, c, v 235 c 260 c d, e, w 220 c 250 c pad dimensions in inches [millimeters] case code a (min.) b (nom.) c (nom.) d (nom.) molded chip capacitors, all types a 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75] b 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25] c 0.118 [3.00] 0.094 [2.40] 0.118 [3.00] 0.307 [7.80] d 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] e 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] v 0.157 [4.00] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] w 0.185 [4.70] 0.098 [2.50] 0.150 [3.80] 0.346 [8.80] a b c d
molded guide www.vishay.com vishay sprague revision: 12-sep-17 7 document number: 40074 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide to application 1. ac ripple current: the maximum allowable ripple current shall be determi ned from the formula: where, p = power dissipation in w at +25 c as given in the tables in the product datasheets (power dissipation). r esr = the capacitor equivalent series resistance at the specified frequency 2. ac ripple voltage: the maximum allowable ripple voltage shall be determi ned from the formula: or, from the formula: where, p = power dissipation in w at +25 c as given in the tables in the product datasheets (power dissipation). r esr = the capacitor equivalent series resistance at the specified frequency z = the capacitor impedance at the specified frequency 2.1 the sum of the peak ac voltage plus the applied dc voltage shall not exceed the dc voltage rating of the capacitor. 2.2 the sum of the negative peak ac voltage plus the applied dc voltage shall not allow a voltage reversal exceeding 10 % of the dc working voltage at +25 c. 3. reverse voltage: solid tantalum capacitors are not intended for use with re verse voltage applied. however, they have been shown to be capable of withstanding momentary reverse voltage peaks of up to 10 % of the dc rating at 25 c and 5 % of the dc rating at +85 c. 4. temperature derating: if these capacitors are to be operated at temperatures above +25 c, the permissible rms ripple curre nt shall be calculated using the derating factors as shown: note (1) applicable for dedicated high temperature product series 5. power dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. non-sinusoidal ripple current may produce heating effects which differ from those shown. it is important that the equivalent i rms value be established when calculating permissible operating levels. (power dissipation calculated using +25 c temperature rise). 6. printed circuit board materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina su bstrates, fr4, fr5, g10, ptfe-fluorocarbon and porcelanized steel). 7. attachment: 7.1 solder paste: the recommended thickness of the solder paste after application is 0.007" 0.001" [0.178 mm 0.025 mm]. care should be exercised in selecting the solder paste. the metal purity should be as high as practical. the fl ux (in the paste) must be active enough to remove th e oxides formed on the metallization prior to the exposure to soldering heat. in practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering, and hot plate methods. the soldering profile charts show recommended time / temperature conditions for soldering. preheating is recommended. the recommended maximum ramp rate is 2 c per s. attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. the soldering iron must never come in contact with the capacitor. 7.2.1 backward and forward compatibility: capacitors with snpb or 100 % tin termination finishes can be soldered using snpb or lead (pb)-free soldering processes. 8. cleaning (flux removal) after soldering: molded capacitors are compatible with all commonly used solvents such as tes, tms, prelete, chlorethane, terpene and aqueous clea ning media. however, cfc / ods products are not used in the production of these devices and are not recommended. solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 when using ultrasonic cleaning, the board may resonate if the output power is too high. this vibration can cause cracking or a decrease in the adherence of the termination. do not exceed 9w/l at 40 khz for 2 min. 9. recommended mounting pad geometries: proper mounting pad geometries are essential for successful solder connections. these dimensions are highly process sensitive and should be designed to minimize component re work due to unacceptable solder joints. the dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. these dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and / or circuit board design. temperature (c) derating factor +25 1.0 +85 0.9 +125 0.4 +150 (1) 0.3 +175 (1) 0.2 +200 (1) 0.1 i rms p r esr ------------ = v rms i rms x z = v rms z p r esr ------------ =
typical performance characteristics www.vishay.com vishay sprague revision: 21-jun-17 1 document number: 40211 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid tantalum chip capacitors mil-prf-55365 qualified and dla approved notes ? all information presented in this document reflects typical performance characteristics electrical performance characteristics item performance characteristics category temperature range - 55 c to +85 c (to +125 c with voltage derating) capacitance tole rance 20 %, 10 %, tested vi a bridge method, at 25 c, 120 hz dissipation factor limit per standard ratings table. te sted via bridge method, at 25 c, 120 hz esr limit per standard ratings table. te sted via bridge method, at 25 c, 100 khz leakage current after application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k resistor in series with the capacitor under test, leakage current at 25 c is not more than described in standard ratings table of appropriate datasheet. note that the leakage current varies with temper ature and applied voltage. see graph below for the appropriate adjustment factor. reverse voltage capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the dc rating at +25 c 5 % of the dc rating at +85 c 1 % of the dc rating at +125 c vishay does not recommend intentional or repetitive application of reverse voltage. ripple current for maximum ripple current values calculation (at 25 c) refer to guide to a pplication part of product guide which is linked with relevant datasheet. if capa citors are to be used at temperatures above +25 c, the permissible ripple current (or voltage) shall be calculated using the derating factors: 1.0 at +25 c 0.9 at +85 c 0.4 at +125 c maximum operating and surge voltages vs. temperature +85 c +125 c rated voltage (v) surge voltage (v) category voltage (v) 4.0 5.3 2.7 6.3 8.0 4.0 10 13.3 6.7 15 / 16 20 10 20 26.7 13.3 25 33.3 16.7 35 46.7 23.3 50 66.7 33.3 recommended voltage derating guidelines (below 85 c) voltage rail capacitor voltage rating 3.3 6.3 510 10 20 12 25 15 35 24 50 or series configuration
typical performance characteristics www.vishay.com vishay sprague revision: 21-jun-17 2 document number: 40211 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes ? at +25 c , the leakage current shall not exceed the value listed in the standard ratings table ? at +85 c , the leakage current shall not exceed 10 times the value listed in the standard ratings table ? at +125 c , the leakage current shall not exceed 12 times the value listed in the standard ratings table typical leakage current - temperature factor environmental performance characteristics item condition post test performance moisture resistance mil-std-202, meth od 106, 20 cycles capacitance change dissipation factor leakage current within 15 % of initial value shall not exceed 150 % of initial limit shall not exceed 200 % of initial limit visual examination: there shall be no evidence of harmful corrosion, mechanical damage, or obliteration of marking (if applicable) stability at low and high temperatures mil-prf-55365 delta cap limit at -55 c is 10 % (20 % for cwr15) of initial value delta cap limit at 85 c is 10 % (15 % for cwr15) of initial value delta cap limit at 125 c is 15 % (20 % for cwr15) of initial value delta cap at step 3 and final step 25 c is 5 % (10 % for cwr15) of initial value dcl at 85 c: 10 x initial specified value dcl at 125 c: 12 x initial specified value dcl at 25 c: initial specified value at rated voltage df change: refer to performance specification sheet for applicable capacitor style step test temperature (c) 1 +25 3 2 -55 + 0 / - 6 3 +25 3 4 +85 + 4 / - 0 5 +125 + 4 / - 0 6 +25 3 surge voltage mil-prf-55365 1000 successive test cy cles at 85 c of applicable surge voltage (as specified in the table above), in series with a 33 resistor at the rate of 30 s on, 30 s off capacitance change dissipation factor leakage current within 5 % of initial value initial specified limit initial specified limit life test at +85 c mil-std-202, method 108 2000 h application of ra ted voltage at 85 c capacitance change dissipation factor leakage current within 5 % (10 % for cwr15) of initial value initial specified limit shall not exceed 200 % of initial limit there shall be no evidence of harmful corrosion or obliteration of marking (if applicable), mechanical damage, intermittent shorts, or permanent shorts or opens life test at +125 c mil-std-202, method 108 2000 h application 2/3 of rated voltage at 125 c capacitance change dissipation factor leakage current within 5 % (10 % for cwr15) of initial value initial specified limit shall not exceed 200 % of initial limit there shall be no evidence of harmful corrosion or obliteration of marking (if applicable), mechanical damage, intermittent shorts, or permanent shorts or opens leakage current factor percent of rated voltage 100 10 1.0 0.1 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 +125 c +85 c +55 c +25 c -55 c 0 c
typical performance characteristics www.vishay.com vishay sprague revision: 21-jun-17 3 document number: 40211 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 mechanical performance characteristics item condition post test performance vibration mil-std-202, method 204, condition d, 10 hz to 2000 hz, 20 g peak, in 2 directions, 4 hour s in each, at rated voltage measurements during vibration: during the last cycle of each plane, electrical measurements shall be made to determine the intermittent open or short circuits. intermittent contact and arcing shall also be determined. measurements after vibration: not applicable visual examination after test: there shall be no evidence of mechanical damage thermal shock (mounted) mil-std-202, method 107 -65 c / +125 c, for 10 cycl es, 30 min at each temperature capacitance change dissipation factor leakage current within 5 % of initial value initial specified limit initial specified limit visual examination: there shall be no evidence of harmful corrosion, mechanical damage, or obliteration of marking (if applicable) resistance to soldering heat mil-std-202, method 210, cond ition j (convection reflow, 235 c 5 c), one heat cycle capacitance change dissipation factor leakage current within 5 % of initial value initial specified limit initial specified limit visual examination: there shall be no evidence of mechanical damage solderability mil-std-202, method 208, ansi/j-std-002, test b (dip- and look, 245 c 5 c). preconditioning per category c (steam aging, 8 hours). does not apply to gold terminations. solder coating of all capacitors shall meet specified requirements. there shall be no mechanical or visual damage to capacitors post-conditioning. resistance to solvents mil-std-202, method 215 there shall be no mechanical or vi sual damage to capacitors post-condition ing. body marking shall remain legible and shall not smear. flammability encapsulation materials meet ul 94 v-0 with an oxygen index of 32 %
legal disclaimer notice www.vishay.com vishay revision: 08-feb-17 1 document number: 91000 disclaimer ? all product, product specifications and data ar e subject to change with out notice to improve reliability, function or design or otherwise. vishay intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, vishay), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. vishay makes no warranty, representation or guarantee regarding the suitability of th e products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, vi shay disclaims (i) any and all liability arising out of the application or use of any product , (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all implied warranties, includ ing warranties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain types of applicatio ns are based on vishays knowledge of typical requirements that are often placed on vishay products in generic applications. such statements are not binding statements about the suitability of products for a particular applic ation. it is the customers responsibility to validate tha t a particular product with the prope rties described in the product sp ecification is suitable for use in a particular application. parameters provided in datasheets and / or specifications may vary in different ap plications and perfor mance may vary over time. all operating parameters, including ty pical parameters, must be va lidated for each customer application by the customer s technical experts. product specifications do not expand or otherwise modify vishays term s and conditions of purchase, including but not limited to the warranty expressed therein. except as expressly indicated in writing, vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the vishay product could result in personal injury or death. customers using or selling vishay product s not expressly indicated for use in such applications do so at their own risk. please contact authorized vishay personnel to obtain writ ten terms and conditions rega rding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is gran ted by this document or by any conduct of vishay. product names and markings noted herein may be trademarks of their respective owners. ? 2017 vishay intertechnology, inc. all rights reserved

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